Resources Developer Site; Xilinx Wiki; Xilinx Github; Support Support CommunityHi, We will use Virtex Ultra+ FPGA (XCVU13P-2FLGA2577E) in our project. DMA 使用之 ADC 示波器(AN706) 26. However, here are just a few of the “migration considerations” found in ug583. 12) March 20, 2019 x. The Xilinx ® Kria™ K26 sy stem-on-module (SOM) is a compact embedded platform that integrates a custom-. For example if you want to find the pin planning information for UltraScale / UltraScale\+ devices go to the Document Navigator and check out UG575. Loading Application. . For UltraScale and UltraScale+, see UG575. This is because the value of BACKBONE is defeatured in the Versal Architecture. The AMD DDR4 core can generate a full controller or phy only for custom controller needs. 1 Removed “Advance Spec ification” from document ti tle. The following is a description for how to modify the pinouts for different devices. R e c o m m e n d e d O p e r a t i n g C o n d i t i o n s. Article Details. However, use-case for Bank 47, 48 and 66 is not allowed since they are not in the same column. Thank you! Look at the Device Diagrams section of UG575 (Packaging and Pinouts) for your device. Resources Developer Site; Xilinx Wiki; Xilinx GithubThe MGT banks that were powered by the supplies MGTAVTT_RN and MGTAVCC_RS in XCKU060-2FFVA1517i. For more information ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full internal operating temperature range (Note 2). I see that some of these are in-stock at digikey. 59 views. ThanksLoading Application. Hi all, I am trying to understand the recommended ways to initialize and/or resetting registers. Product Application Engineer Xilinx Technical SupportWe would like to show you a description here but the site won’t allow us. // Documentation Portal . cara mendapatkan freechip di situs agen slot UG36 dengan menggunakan bocoran kode rahasia langsung dari pengembang situs agen slot UG36See UG575, UltraScale Architectu re Packaging and Pinou ts User Guide f or more information. All Answers. Like Liked Unlike Reply 1 like. GTH bank location errors. Regards, Cousteau. . For UltraScale and UltraScale+, see UG575. 1) September 14, 2021 11/24/2015 1. These dimensions were provided in Figure 1-15 for XCVU31P and XCVU33P in FSVH1924/2104, Figure 1-16 for XCVU35P in FSVH2104/2892 and Figure 1-17 for XCVU37P in FSVH2892. CSV) files available in OrCAD? ブート. AMD Virtex UltraScale+ XCVU13P. デバイス資料 (ザイリンクス) 『Zynq-7000 SoC テクニカル リファレンス マニュアル』 (UG585) は、Zynq SoC のアーキテクチャ、機能、および制御およびステータス レジスタの詳細な説明を含む総合的なユーザー ガイド (1700ページ以上) です。. OLB) files for the schematic design. OTHER INTERFACE & WIRELESS IP. Expand Post. UG475 is a user guide that provides detailed information on the pinout and package specifications of the 7 series FPGAs from Xilinx. I want to use 5 DDR4 component memories (x16 type) and i need to connect them to 3 HP banks (44,45**BEST SOLUTION** Hello @rmirosanros5, These behaviors are hard coded when the IP Is generated. I/O Features and Implementation. The GT quad 226 you have selected is a middle quad of the SLR. >>The top-of-the-line Core i9-13900KS supports x16+x4 or x8+x8+x4. Introducing Versal ACAP, a fully software-programmable, heterogeneous compute platform that combines Scalar Engines, Adaptable Engines, and Intelligent Engines to achieve dramatic performance improvements of up to 20X over today's fastest FPGA implementations and over 100X over today's fastest CPU implementations—for Data. 12) August 28, 2019 08/18/2014 1. pdf. I always wondered where I can find the physical location of every single resource of an FPGA. 233194itrnyenye (Member) asked a question. This package thermal details are required to simulate Micron module with VU13P package with appropriate thermal constraints like ambient and flow conditions. . Device : xcku085 flva1517 vivado version: 2018. It seems the value for M is too high (UG575, table 8-1). 0. Kintex™ 7 FPGA Package Files. Resources Developer Site; Xilinx Wiki; Xilinx GithubUltraScale Architecture GTH Transceivers 6 UG576 (v1. 0. right or left . . Bee (Customer) 7 months ago. 7. E. My specific concern is the height from the seating plane (dimension A). pdf · adba5616e0bc482c1dc162123773ced75670d679. 18) April 22, 2022 Chapter 4: Mechanical Drawings UBVA368 Flip-Chip, Fine-Pitch BGA (XCAU10P and XCAU15P) X-Ref Target - Figure 4-1 Figure 4. PL 读写 PS 端 DDR 数据 20. • If all of the Quads in a power supply group are not used, the associated power pins can be left unconnected or tied to GND (unless the RCAL circuit is in that Quad). UG575, p. control with soft and hard engines for graphics, video, waveform, and packet processing. + Log in to add your community review. ) but with no clear understanding. You can find that GT quad which is placed in the middle of the SLR is not supported with any PCIe blocks in the device. Hello, I am. Resources Developer Site; Xilinx Wiki; Xilinx Github Bank Diagram is in the UG575 regarding the XCAU25P-FFVB784. Then I create an xdc file and add constraints like these: create_clock -add -name sys_clk_pin -period 13. The similar Bank is the XCKU3P-SFVB784/FFVD900, too. For devices with high-bandwidth memory (HBM), the storage temperature is the case surface temperature on the center/top side of the device. Thank you!. 9. Loading Application. Dragonboard is ideal in floor applications where non combustibility and resistance to abuse, termites. Virtex UltraScale+ FPGA Data Sheet: DC and AC Switching Characteristics DS923 (v1. 0) and UG575 (v1. I want to use 5 DDR4 component memories (x16 type) and i need to connect them to 3 HP banks (44,45,46) because of resource availability. Expand Post. 8. 1) is incorrect. Also, when I try to create a bus with less than 2 bytes worth of bits, I see many LVDS pair hidden from the drop down. 嵌入式开发. Expand Post. It seems the value for M is too high (UG575, table 8-1). -- (c) Copyright 2016 Xilinx, Inc. The pinout files list the pins for each device, such as CNA1509, FFRA1156, FFRB676, and XQKU5P, and their functions. tzr and pdml format . 焊接温度如下：100 120 140 160 180 200 235 260，对应的持续时间为：40 40 40 50 50 50 50 40。 查看了UG575的 Soldering Guidelines ，是不是200°以上持续时间偏长（140s），要求是60–150s；且不应该是260度（文档上要求为FFVA1156，Mass reflow:245°）焊接引起的。Ultra-Compact Packaging. Does Xilinx provide OrCAD symbol files ? If not, how to use the ASCII Pinout Files in ug575 to create OrCAD symbols in (. Loading Application. Imported from Library of Congress MARC record . 7. As you say, the STARTUPE3 is needed to access the CCLK output of the FPGA, which connects to both flash devices. The Radeon Pro 575 is a professional mobile graphics chip by AMD, launched on June 5th, 2017. All rights reserved. Up to 674 free user I/O for daughter board connection. デバイス資料 (ザイリンクス) 『Zynq-7000 SoC テクニカル リファレンス マニュアル』 (UG585) は、Zynq SoC のアーキテクチャ、機能、および制御およびステータス レジスタの詳細な説明を含む総合的なユーザー ガイド (1700ページ以上) です。. We would like to show you a description here but the site won’t allow us. 5Gb/s. . Bank 47 and 48 are okay if it places the MIG IP. UG575 (v1. This chapter provides an overview of clocking and a comparison between clocking in the UltraScale architecture and previous FPGA. Hello @hpetroffxey5 . DMA 使用之 DAC 波形发生器(AN108) 23. Using the buttons below, you can accept cookies, refuse cookies, or change. From the graphics in UG575 page 224 I would say 650/52. Resources Developer Site; Xilinx Wiki; Xilinx GithubLoading Application. 7. 另外， kintex-ultrascale系列器件有官方的开发板吗？. The scheduling of PHY commands is automatically done by the memory controller and t4. 感谢！. 6) and X0Y0 for VU125 (as per Figure 1-53 in UG575 v1. For your part, looking at UG575, either of these configurations would work for these banks. Thanks, Sam// Documentation Portal . GTH transceivers in A784, A676, and A900 packages support data rates up to 12. refer the attached images for Xilinx & Si5391(PLL planned to use) LVPECL termination requirements. 13) September 27, 2019. Download the Device Packaging and Pinouts pdf user guide matching your device familiy (UG575 UltraScale Device Packaging and Pinouts for ultrascales. Select search scope, currently: catalog all catalog, articles, website, & more in one search; catalog books, media & more in the Stanford Libraries' collections; articles+ journal articles & other e-resourcesThese pinout files can be downloaded using links found in Chapter 2 of UG575. A user asks when version 1. For a quick estimate you can look at bank numbers, usually they are consecutive for the same column with a gap between columns but there is no number gap for the SLR split. Best regards, Kshimizu . J. UG570 UltraScale Architecture Configuration UG575 UltraScale and UltraScale+ FPGAs Packaging and Pinouts UG571 UltraScale Architecture SelectIO UG576 UltraScale Architecture GTH Transceivers UG572 UltraScale Architecture Clocking Resources UG579 UltraScale Architecture DSP SliceFrom UG575, we know how to put the pins in continuous 3 banks, but there's no column information for each bank. According to the user guide UG575, the SMBALERT pin is an optional PMBus alert signal, when Low, indicates a system fault . The Ellesmere graphics processor is an average sized chip with a die area of 232 mm² and 5,700 million transistors. Regards, Musthafa V. g, X0Y0, X1Y0 etc) are not mentioned in it. There are Four HP Bank. LTM4622 3 Re. Please check with ug575 and ug583. Loading Application. UltraScale Architecture GTY Transceivers 4 UG578 (v1. The following table lists the device, number of pins, part number, silicon type, package type, and downloadable package drawing for the devices. Bee (Customer) 7 months ago. AMD Adaptive Computing Documentation Portal. In the ZYNQ instance inside IPI, the IRQ_F2P bus cannot be changed from [0:0] even though the documentation states it's a 16 bit bus. 12) ) Each I/O bank has 52 pins that can be used for IO (see page-151 of UG571) Total HP and HR IO is (from 3) and 4)) equal to 520 pins and each has its own BITSLICE_RX_TX that can be configured as either ODELAYE3 or IDELAYE3. The Official Home of DragonBoard USA. Resources Developer Site; Xilinx Wiki; Xilinx GithubpageName • AMD Adaptive Computing Documentation Portal. // Documentation Portal . 1) September 14, 2021 11/24/2015 1. It seems there is a discrepancy between the Ultrascale selection guide for XCKU095 there is written 650 HP I/O and 52 HR I/O for the B1760 package and in the UG575 page 25 Table 1-4 FFVB1760 package 598 HP I/O and 52 HR I/O. What is the meaning of this table？. Loading Application. Loading. AMD Virtex UltraScale+ XCVU13P. All Answers. No other PCIe boards are being used in the system. All other packages liste d 1mm ball pitch. > I found a newer version of the document and it had the device I am usingPackaging. 6. Hello, I'm looking through the Zync Ultrascale+ datasheet and I can't find where it lists which banks are HR and which are HP and in the IP Planner it only shows High Density andLooking through the Package and Pinout guides for 7-Series (UG475) and UltraScale (UG575), I find that all packages are BGA. 1) besides, there are some warning messages showed below: WARNING: [Xicom 50-38. @Ralf_Leef_l8 For Mechanical Drawing, a new version of UG575 is expected to be out soon and will have the details for VU23P. com 注 : zip ファイルには、txt および csv 形式の ascii パッケージ ファイルが含まれます。このファイル形式は、 ug575 で説明されています。 This web page provides the pinout files for the UltraScale and UltraScale+ packages, which are used in Xilinx FPGA devices. PROGRAMMABLE LOGIC, I/O AND PACKAGING. com. kr (Member) 3 years ago. The SOM is designed to. To provide specific guidance d**BEST SOLUTION** Hi @dragonl2000lerl3,. 6) August 26, 2019 11/24/2015 1. I believe the specific part you are using is the XCKU040-2FFVA1156E from the KCU105 home page, so I recommend looking through that UG with that part in mind. Resources Developer Site; Xilinx Wiki; Xilinx Github; Support Support Community However, when I open the synthesized design I do not see the expected I/O PACKAGE_PIN locations of the GTYs as defined by the UltraScale and UltraScale+ Packaging and Pinouts Guide (UG575). The information is available in UG575 (Ultrascale and Ultrascale+ FPGAs Packaging and Pinouts) document. Can anyone verify this for me please? Thank you, Joe. : ID Numbers Open Library OL754986M ISBN 10 3881803181, 3881803408 LCCN 97150347 Goodreads 5493532. PCIe blocks are present on top and bottom of the SLR. Community Reviews (0) Feedback? No community reviews have been submitted for this work. Edited by MARC Bot. To determine factory floor life and soak requirements, and for more information on moisture sensitivity, refer to Chapter 6 of (UG112) the Device Package User Guide. UG575 (v1. After I changed to dedicated ports for GT's reference clock and things are right. You can refer to UG575 to check which ports can be used as GT's reference clock. . You can only route the reference clock to adjacent quads and the should be no SLR crossing between them. A second way to answer the question is to download the package file for your FPGA from <here>. My specific concern is the height from the seating plane (dimension A). Product Application Engineer Xilinx Technical Support Loading Application. // Documentation Portal . (rouhgly 13*51 - 1/2 * 51 HP and 2 * 24 HR). 03/20/2019 1. Look at the Device Diagrams section of UG575 (Packaging and Pinouts) for your device. We would like to show you a description here but the site won’t allow us. More specific in GT Quad and GT Lane selection. Resources Developer Site; Xilinx Wiki; Xilinx GithubCheck out UG575. 18) April 22, 2022 Chapter 4: Mechanical Drawings UBVA368 Flip-Chip, Fine-Pitch BGA (XCAU10P and XCAU15P) X-Ref Target - Figure 4-1 Figure 4-1: Package Dimensions for UBVA368 (XCAU10P and. For example if you want to find the pin planning information for UltraScale / UltraScale+ devices go. A very similar package (FFVA1156) which I found in the document UG575 has three different heights listed for different parts (Figures 4-12, 4-13 and 4-14), so I'm not sure if the listed nominal height (A=3. 3. 12) March 20, 2019 x. . seamusbleu (Member) 2 years ago **BEST SOLUTION** Check out UG575. junction, case, ambient, etc. Now i imported my. com. Resources Developer Site; Xilinx Wiki; Xilinx Github (UG575). . Expand Post. 工場のフロアライフおよびソーク要件を決定するには、『デバイス パッケージ. Is the 6mil shown here a mistake?PCIe Reset on VU11P on bank 65. Reader • AMD Adaptive Computing Documentation Portal. Hi, I found below links from UG575v1. All other packages liste d 1mm ball pitch. Refer to the "Transceiver Quad Migration" table in Chapter 1 of UG575, UltraScale Architecture Packaging and Pinouts User Guide (for FPGA) or UG1075, Zynq UltraScale+ MPSoC Packaging and Pinouts User Guide (for MPSoC) to identify in which power supply group a specific GTH/GTY Quad is located. Offering up to 20 M ASIC gates capacity. Loading Application. Please double-check the flight number/identifier. // Documentation Portal . A reply explains that version 1. Child care and day care. . Up to 1. 10. UG575 (v1. "X1 Y20" Column Used: e. The web page is a forum thread from Xilinx users who discuss the topic of UG575 v1. // Documentation Portal . Resources Developer Site; Xilinx Wiki; Xilinx Github デバイス ビューの座標情報が正しいため、ug575 を修正するよう変更リクエストが提出されています。 2016 年 1 月以前にリリース予定の ug575 v1. 6mm (with 0. 000020638. AMD Adaptive Computing Documentation Portal. Product Application Engineer Xilinx Technical Support要找一下 kintex-ultrascale系列器件的BANK 0 pin脚配置说明；请告知具体在哪一份文档？. Selected as Best Selected as Best Like Liked Unlike 1 like. What is the meaning of this table？. Preview. Product Application Engineer Xilinx Technical SupportI've been trying to do so, but the tool automatically places a BUFG in the middle and the placement fails. I use SMBALERT as an indicator signal on my board, and in some cases, I have noticed that during FPGA startup, where the SMBALERT signal is pull. For 7-Series FPGAs, see UG475. Hi, I am looking for the thermal resistance from junction to board and thermal resistance from junction to case for the XQVU5P-1FLQA2104I. UG575 (v1. Xilinx does not provide OrCAD schematic symbols. Download as Excel. UltraScale Architecture GTY Transceivers 4 UG578 (v1. payload":{"allShortcutsEnabled":false,"fileTree":{"Datasheet/XILINX":{"items":[{"name":"ds180_7Series_Overview. 9/9/2014. 官方不直接提供器件的原理图和pcb库，需要参考ug575自己建库。 如果是使用AD软件，可以去AD官网看一下，他们好像提供xilinx器件的库。 Expand PostHi, I'm planning to use a XCKU060 in FFVA1517 package and I have a question regarding the following statement: "If all of the Quads in a power supply group are not used, the assocHi I am trying to make a hardware design with ultrascale xcku035-ffva1156 FPGA. Usually solder-mask is 4mil larger that the solder land. com. . UG575, UltraScale and UltraScale+ FPGAs Packaging and Pinouts Product Specification UG576, UltraScale Architecture GTH Transceivers User Guide UG578, UltraScale Architecture GTY Transceivers User Guide UG579, UltraScale Architecture DSP Slice User Guide UG580, UltraScale Architecture System Monitor User Guide2. The -2LE and -1LI devices can operate at a VCCINT voltage at 0. In some cases, they are essential to making the site work properly. UG575 (v1. Note: The zip file includes ASCII package files in TXT format and in CSV format. Expand Post Like Liked Unlike Reply 1 likeAs FPGAs can be used in a variety of different application scenarios we provide general guidance in our packaging user guides and application notes. However, during the Aurora IP customization I can only select: Starting Quad e. The package file for XCKU5P-2FFVB676E shows that pin-N21 is in HP-bank #65 and has designation, IO_L24P_T3U_N10_EMCCLK_65. The format of this file is described in UG1075. Lists. . 70% smaller and 73% thinner than chip-scale packaging, Artix UltraScale+ FPGAs with InFO packaging deliver leading compute density, including serial I/O bandwidth and DSP compute/mm. On the KCU116 board, the User Guide (UG1239) shows that the FPGA is a XCKU5P-2FFVB676E and that a clock source called EMCCLK is routed to pin-N21. A reply explains that version 1. Packages with a Level 1 MSL rating are the least sensitive to moisture, and packages with larger numbers are relatively more sensitive to moisture. 8mm ball pitch. ug575 Zynq TRM, page 231 table 7-4. Is it compulsory to use the Bank 65 PERSTN0 for PCIe reset or any normal IO can be used PCIe reset?// Documentation Portal . pdf","path":"Datasheet/XILINX/ds180_7Series_Overview. QUALITY AND RELIABILITY. If so, could any pin act as a synchronized reset input?Open, closed, and transaction based pre-charge controller policy. pdf}} (v1. Selected as Best Selected as Best Like Liked Unlike. Regards, TC. GC inputs can be used as regular I/O if not used as clocks. We would like to show you a description here but the site won’t allow us. GTH transceivers in A784, A676, and A900 packages support data rates up to 12. 9. If it is just the location constraints that you need to adjust, you can do so in your toplevel xdc file without changing in IPI. . I always wondered where I can find the physical location of every single resource of an FPGA. Dragonboard Magnesium Oxide Board (MgO) is a lightweight alternative to poured concrete. Thanks, Suresh. It is market as PC44CEM0015 F1117188A The marking is in bright white and easily readable. Saturday 13-May-2023 08:02AM PDT. [email protected]/s. GTH transceivers in A784, A676, and A900 packages support data rates up to 12. Resources Developer Site; Xilinx Wiki; Xilinx GithubAMD Adaptive Computing Documentation Portal. 8. // Documentation Portal . March 10, 2021 at 5:57 PM. From the graphics in UG575 page 224 I would say 650/52. Can you please suggest the drill dia and pad dia for the via as well? Regards, Raja GTH bank location errors. 感谢！. But what about the applied pressure on the lidless FPGA? We can read page 326 : "Xilinx recommends that the. . Are there any rules of thumb for power draw threshold from the ultrascale parts that requires a heat sink? I suspect my design will be fine without one. Facts At A Glance. 12) March 20, 2019 x. 0. Are they marked in ug575-ultrascale-pkg-pinout. (on time) Saturday 13-May-2023 12:13PM MST. Hello @rmirosanros5, Ah, if you're using a Zynq device then you'll need to look at UG1075. May 7, 2018 at 4:42 AM. I find much good reading about this in chapter-4 of ug583 and starting on page-31 of ug575. I was able to access the configuration flash via my custom spi-controller with a XC7VX485T and some 7series Artix devices. Dragonboard is ideal in floor applications where non combustibility and resistance to. 5Gb/s. It seems there is a discrepancy between the Ultrascale selection guide for XCKU095 there is written 650 HP I/O and 52 HR I/O for the B1760 package and in the UG575 page 25 Table 1-4 FFVB1760 package 598 HP I/O and 52 HR I/O. Resources Developer Site; Xilinx Wiki; Xilinx Github; Support Support CommunityRF & DFE. The similar Bank is the XCKU3P-SFVB784/FFVD900, too. 12) helps us. // Documentation Portal . Adding the CLOCK_DEDICATED_ROUTE constrain set to false, eliminate the BUFG auto-adding but the placement fails again with the error: Place 30-99 Placer failed with error: 'IO clock placer failed' Please revise all ERROR, CRITICAL WARNING. 11). Selected as Best Selected as Best Like Liked Unlike. 12) March 20, 2019 Chapter 1: Pack aging Overview Zynq® UltraScale+ MPSoC devices provide 64-bit processor scalability while combining UG575, UltraScale and UltraScale+ FPGAs Packaging and Pinouts Product Specification UG576, UltraScale Architecture GTH Transceivers User Guide UG578, UltraScale Architecture GTY Transceivers User Guide UG579, UltraScale Architecture DSP Slice User Guide UG580, UltraScale Architecture System Monitor User Guide UltraScale Architecture GTH Transceivers 6 UG576 (v1. Artix UltraScale+ FPGAs are the industry’s only FPGA available in Integrated Fan-Out (InFO) for small form factor packaging. Resources Developer Site; Xilinx Wiki; Xilinx Github@229853eikganrho (Member) . Product Specification (UG575) . pdf? Unfortunately, I cannot find informtation on this in pg188-hig-speed-selectIO-wiz. Flexible via high-speed interconnection boards or cables. . GTH transceivers in A784, A676, and A900 packages support data rates up to 12. We see that UG575 mentions the BGA nominal dia of 0. and what should i do if there is a pair of clock differential input signal and i need them to be a globle clock?(which doc should i look for?) a solution: clk_p/clk_n ----->IBUFDS-----> BUFG----->MMCM? 2. SoC and MPSoC/RFSoC Package Files. Even an ACSII version would be helpful. 6mm (with 0. 3 of UG575 will be available and if it will be compatible with the new KU085 and KU095 devices. 1 and vivado2015. ug575 Zynq TRM, page 231 table 7-4. The package file for XCKU5P-2FFVB676E shows that pin-N21 is in HP-bank #65 and has designation, IO_L24P_T3U_N10_EMCCLK_65. This site uses cookies from us and our partners to make your browsing experience more efficient, relevant, convenient and personal. Resources Developer Site; Xilinx Wiki; Xilinx GithubDoes Maximum PCB solder land (L) diameter (see attached pic for UG575) really refers to the maximum value? Is there a typical value? Which value is it recommended to use? 3. FPGA Bank Columns. As you say, the STARTUPE3 is needed to access the CCLK output of the FPGA, which connects to both flash devices. -- -- This file contains confidential and proprietary information -- of Xilinx, Inc. A single PCIe4 Integrated Block is capable of Gen3x16, but this requires 4 adjacent GT Quads. Scope. Nothing found. 27). MSL レベル 1 のパッケージは感湿度が最も低く、数値が大きいほど感湿度が高くなります。. Hello. GTH transceivers in A784, A676, and A900 packages support data rates up to 12. Selected as Best Selected as Best Like Liked Unlike 1 like. Is the 6mil shown here a mistake?PCIe Reset on VU11P on bank 65. XCKU060-2FFVA1517E soldering. 3 Product Guide, It is mentioned that PCIe Reset (PERSTN0) on Bank 65 should be used for PCIe Reset. 注 : zip ファイルには、txt および csv 形式の ascii パッケージ ファイルが含まれます。このファイル形式は、 ug575 で説明されています。Edited by wcassell June 12, 2022 at 11:03 PM. GC inputs can connect to the PHY adjacent to the. The GTY tranceiver is a hard block inside the FPGA, and there are. You also see the available banks in ug575, page63, figure 1-16. デバイス資料 (ザイリンクス) 『Zynq-7000 SoC テクニカル リファレンス マニュアル』 (UG585) は、Zynq SoC のアーキテクチャ、機能、および制御およびステータス レジスタの詳細な説明を含む総合的なユーザー ガイド (1700ページ以上) です。. The marking that is not even shown in the UG575 is the three digit number in right bottom corner. 2 V VIH High Level Logic Input Voltage 2. 3. Search the PIN number in this file.